Samsung to Use TSMC 3nm Process for Nvidia's Next-Generation HBM Base Dies
Samsung Electronics will use TSMC's 3-nanometre process to produce the base dies for Nvidia's next-generation custom high-bandwidth memory, the Seoul Economic Daily reported on Sunday. The move would mark the first time Samsung has worked with the Taiwanese contract chipmaker at the HBM manufacturing stage, according to the report, which Reuters summarized on October 18.